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Thermally Conductive Adhesive Tapes   >> Bond-Ply Materials
 
  SIL-PAD Construction
are designed to retain high bond strength to a variety of surfaces and to maintain long term exposure to moderate heat & high humidity. Use these materials instead of, heat cure adhesives, screw mounting and clip mounting applications.
   
 
       
Bond-Ply100
Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape.
   Bond-Ply400
High Cut-Through Resistant, Electrically Insulating, Thermally Conductive Material.		  

Bond-Ply660
Economical, Electrically Insulating, Thermally Conductive, Soft Tack Elastomeric Material.

    
             
Thermally Conductive Liquid Adhesive
         
Liqui Bond SA 2000 (one-part)
Thermally Conductive, One-Part, Liquid Silicone Adhesive.		   Liqui Bond SA 1000 (one-part)
Thermally Conductive, One-Part, Liquid Silicone Adhesive.		        
 
 
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